Title:
RESIN FILM FOR ELECTRIC CONNECTION AND ELECTRIC CONNECTING METHOD USING RESIN FILM
Document Type and Number:
Japanese Patent JP3120837
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve connection reliability in the case of an electric connection due to a resin film.
SOLUTION: Concerning a resin film 1, insulated particles 3 of small thermal expansion coefficient and large diameter and conductive particles 3 of small diameter are mixed into insulated resins. Concerning the conductive particle 4, a metal layer is formed on the surface of a core insulator composed of spherical silica similarly to the insulated particle 3. When such a resin film 3 is thermally press-fitted while being sandwiched between a metal projection 8a and a connecting terminal 7, a thermosetting or thermoplastic resin 2 mechanically bonds a semiconductor chip 5 and a circuit board 6. At such a time, since the conductive particle 4 of small diameter is residual between the metal projection 8a and the connecting terminal 7 sometimes but the insulated particle 5 of large diameter is not residual, the electric connection is secured. Further, since the thermal expansion coefficient is lowered by the insulated particles 3 and the core insulator, the degradation of strength with the passage of time can be suppressed.
Inventors:
Yoshitsugu Funada
Rieka Ouchi
Rieka Ouchi
Application Number:
JP6859198A
Publication Date:
December 25, 2000
Filing Date:
March 18, 1998
Export Citation:
Assignee:
NEC
International Classes:
C09J9/02; C09J11/04; H01B1/20; H01B5/16; H01L21/60; H05K3/32; (IPC1-7): H01L21/60; H01B5/16
Domestic Patent References:
| JP888247A | ||||
| JP4332404A | ||||
| JP2204918A |
Attorney, Agent or Firm:
Nobuyuki Kaneda (2 others)