Title:
RESIN FILM FOR FORMING BUMP
Document Type and Number:
Japanese Patent JPS6448449
Kind Code:
A
Abstract:
PURPOSE: To prevent the mutual connection of adjacent bumps, and to form excellent bumps, free of transfer failure, by using a film in which a metallic foil is laminated onto a base film or a metal is evaporated onto the base film.
CONSTITUTION: A transparent polyester film is employed as a base film, and either one kind of aluminum, nickel or copper is used as a metallic layer. A conductive resin film is positioned to a substrate with a wiring pattern, only a bump forming section is irradiated with laser beams, and the conductive resin film is peeled, thus transferring a resin only to a section as a bump. Accordingly, adjacent bumps are not connected mutually, thus forming bumps excellently free of transfer failure.
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Inventors:
MIYASAKA HITOSHI
Application Number:
JP20560087A
Publication Date:
February 22, 1989
Filing Date:
August 19, 1987
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H01L21/60; H05K1/09; H05K3/04; H05K3/24; H05K3/40; (IPC1-7): H01L21/92
Attorney, Agent or Firm:
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