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Title:
RESIN FILM, POLARIZING PLATE USING THE SAME, AND CUTTING METHOD OF RESIN FILM
Document Type and Number:
Japanese Patent JP2018112754
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin film cut by a laser, where even when a polymer material itself constituting the film has no absorption in an oscillation wavelength range of the laser, the film can be favorably cut, and to provide a polarizing plate obtained by sticking the film to a polarizer.SOLUTION: A resin film is cut by a laser, and is formed from a composition obtained by blending a polymer material having no absorption in an oscillation wavelength range of the laser used for a cutting work with an additive having absorption in the oscillation wavelength range of the laser. A polarizing plate is obtained by sticking the resin film to a polarizer formed from a polyvinyl alcohol-based resin film as a protection film. There is also provided a method for cutting the resin film by a laser.SELECTED DRAWING: None

Inventors:
FURUTA KATSUHIRO
FUJII KANJI
Application Number:
JP2018053953A
Publication Date:
July 19, 2018
Filing Date:
March 22, 2018
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
G02B5/30; B23K26/38; C08J5/18; C08L65/00
Domestic Patent References:
JPH0780670A1995-03-28
JP2010076181A2010-04-08
JP2011053673A2011-03-17
JP2008031375A2008-02-14
JP2009086675A2009-04-23
JP2013500869A2013-01-10
Foreign References:
US20120236263A12012-09-20
WO2011122437A12011-10-06
Other References:
レーザー学会, レーザーハンドブック, vol. 第2版, JPN6020021784, 25 April 2005 (2005-04-25), JP, pages 119頁, ISSN: 0004291363
Attorney, Agent or Firm:
Toru Nakayama
Toru Sakamoto