Title:
RESIN FILM PRODUCTION METHOD AND METHOD OF MANUFACTURING FLEXIBLE DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2021138926
Kind Code:
A
Abstract:
To provide a resin film production method which enables easy peeling of a resin film from a support substrate without through a long-term peeling layer formation step and without aggravating transparency and mechanical strength characteristics of a resin film, and a method of manufacturing a flexible device in which an element and a circuit are formed on a resin film.SOLUTION: A resin film production method includes at least the following steps: a step (A) of forming a peeling layer on a support substrate using a peeling layer formation agent including a silane coupling agent; a step (B) of applying solution represented by (I) or (II) onto the peeling layer, the (I) being solution including a heat-resistant resin precursor or a heat-resistant resin including a dialkyl siloxane bond group, the (II) being solution including a heat-resistant resin precursor including no dialkyl siloxane bond group or a heat-resistant resin including no dialkyl siloxane bond group, and a compound represented by general formula (4); a step (C) of heating the support substrate, thereby forming a heat-resistant resin film on the support substrate; and a step (D) of peeling the heat-resistant resin film from the support.SELECTED DRAWING: None
Inventors:
SAEKI AKINORI
MIYAZAKI DAICHI
MITSUI HIROKO
MIYAZAKI DAICHI
MITSUI HIROKO
Application Number:
JP2021012740A
Publication Date:
September 16, 2021
Filing Date:
January 29, 2021
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08J5/18; B29C41/12; C08G73/06