Title:
RESIN FILM, RESIN FILM WITH SUPPORT, PREPREG, METAL-CLAD LAMINATED SHEET AND MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2016131244
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide: a resin film for manufacturing a printed wiring board for a millimeter wave radar, having favorable dielectric characteristics in a high frequency region and also having sufficient adhesiveness with a conductor; a prepreg; a metal-clad laminated sheet for a millimeter wave radar; and a multilayer printed wiring board.SOLUTION: The present invention relates to a resin film for manufacturing a printed wiring board for a millimeter wave radar, which contains a compound having a maleimide group, a divalent group having at least two imide bonds, and a saturated or unsaturated divalent hydrocarbon group.SELECTED DRAWING: None
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Inventors:
TANIGAWA TAKAO
IRINO TETSURO
KONDO YUSUKE
MIZUSHIMA ETSUO
SHIMAYAMA YUICHI
MURAI HIKARI
IRINO TETSURO
KONDO YUSUKE
MIZUSHIMA ETSUO
SHIMAYAMA YUICHI
MURAI HIKARI
Application Number:
JP2016004432A
Publication Date:
July 21, 2016
Filing Date:
January 13, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H05K3/46; B32B15/08; B32B27/34; C08J5/24; C08K3/00; C08L35/00; C08L79/08; H05K1/03
Domestic Patent References:
| JP2011012124A | 2011-01-20 | |||
| JP2013211348A | 2013-10-10 | |||
| JP2011091066A | 2011-05-06 | |||
| JP2013083958A | 2013-05-09 | |||
| JP2014001289A | 2014-01-09 | |||
| JP2014070084A | 2014-04-21 | |||
| JPH04239637A | 1992-08-27 | |||
| JP2014034630A | 2014-02-24 |
Foreign References:
| WO2012121164A1 | 2012-09-13 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano