Title:
樹脂焼成物及びこれを搭載した電子機器
Document Type and Number:
Japanese Patent JP4378424
Kind Code:
B2
Abstract:
The present invention provides a baked resin product that exhibits an excellent heat resistance and an electronic device that incorporates this baked resin product. The present invention provides a baked resin product obtained by baking a resin composition that contains a main chain-type aromatic benzoxazine structure, wherein the baked resin product has a peak measured by 13C-NMR at 58±2 ppm and a half width of this peak of 4 to 10 ppm. The present invention also provides a method of producing a baked resin product, comprising baking a resin composition that contains a main chain-type aromatic benzoxazine structure at 270° C. to 350° C. The present invention further provides an electronic device that incorporates this baked resin product.
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Inventors:
Chihisa Yoshinori
Yuji Eguchi
Kazuo Tsuchiyama
Yuji Eguchi
Kazuo Tsuchiyama
Application Number:
JP2008514464A
Publication Date:
December 09, 2009
Filing Date:
May 01, 2007
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C08L61/34; C08G14/073
Domestic Patent References:
| JP2005272743A | ||||
| JP2003064180A | ||||
| JP6505693A | ||||
| JP2001316945A | ||||
| JP2004224982A | ||||
| JP10008326A | ||||
| JP9055453A | ||||
| JP3247566A | ||||
| JP2003109608A | ||||
| JP2002280356A |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Toshifumi Onuki