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Title:
RESIN FRAME ASSEMBLY AND ASSEMBLING METHOD THEREOF
Document Type and Number:
Japanese Patent JP3916309
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a resin frame assembly that can be used under strict environments having no breakage and deformation due to impact such as dropping or the like or cold heat cycle.
SOLUTION: A thermoplastic resin composition is used which consists of a 3-30 wt.% graft polymer obtained by graft-copolymerizing one or more vinyl monomers selected from the group consisting of an aromatic vinyl monomer, a vinyl monomer cyanide, and a methacryl acid ester to 20-87 wt.% polycarbonate resin (A), 10-60 wt.% thermoplastic polyester resin (B), and a rubber polymer (C) for obtaining a molded item having the resin frame and functional part of a molded item with a thermoplastic resin composition, and further a resin frame assembly is made by a method of joining the resin frame and resin part of the molded item through insert molding by a heat welding method.


Inventors:
Kiyoshi Yamamoto
Koichi Shimizu
Application Number:
JP31029497A
Publication Date:
May 16, 2007
Filing Date:
November 12, 1997
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
B29C65/02; C08J5/12; B29C45/14; C08L69/00; B29K9/00; B29K67/00; B29K69/00; B29K105/06; C08L55/02; C08L67/02; (IPC1-7): B29C65/02; B29C45/14; C08L69/00; //C08J5/12; (C08L69/00; C08L67:02; C08L55:02); B29K67:00; B29K69:00; B29K105:06
Domestic Patent References:
JP4169214A
JP4363357A
JP7207135A
JP4214759A
JP4085360A
JP64006050A
JP63132961A
JP63083158A
JP9124953A
JP9241508A