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Title:
RESIN GAME BOARD AND MOLDING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2012005826
Kind Code:
A
Abstract:

To provide a resin game board which is excellent in moldability, nailing properties, nail holding properties, dimensional stability, machinability and the like, and to provide a molding method thereof.

In the method for molding a square thick plate-like game board to be mounted with generators by use of resin, an injection molding die including air vents for discharging air in a cavity formed by the injection molding die is used, the air vents being formed in respective side portions of a bottom portion on a movable mold M2 side of the cavity and an anti-bottom portion on a fixed mold M1 side of the cavity which is opposed thereto. A void portion is formed in a part opposed to the bottom portion of the cavity by a core back injection molding method for closely injecting and charging a molten resin raw material K containing a foaming agent into the cavity and retreating the movable mold M2 constituting the molding die to enhance the degree of foaming the resin by the existence of the void portion, and the air generated during foaming is discharged through the air vents to form the resin game board having a plate thickness corresponding to the thickness of a molding space after retreating the movable mold M2.


Inventors:
MATSUSHIMA KOZO
ITO NORIO
Application Number:
JP2011115295A
Publication Date:
January 12, 2012
Filing Date:
May 24, 2011
Export Citation:
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Assignee:
SANKEI CO LTD
ITO TEKKOSHO KK
ASAHI KASEI CHEMICALS CORP
International Classes:
A63F7/02
Domestic Patent References:
JP2006094879A2006-04-13
JP2007182025A2007-07-19
JP2006159898A2006-06-22
JPH11347223A1999-12-21
Attorney, Agent or Firm:
Tetsuhiro Naito