To provide a resin for heat imprint with low resin modulus of elasticity at fluidization and sufficient fine pattern transferring property excellent in thermal deterioration resistance in order to suppress generation of a particulate substance in fine processing by heat imprint, a resin solution for heat imprint using the resin, an injection molded body for heat imprint using the resin, a thin film for heat imprint using the resin, and its manufacturing method.
In the resin for heat imprint, in measurement of a differential scanning calorimeter at temperature-elevation speed of 5C/min in air, an exothermic initiation temperature (oxidation initiation temperature) of an exothermic peak accompanying oxidation is a temperature of the glass transition temperature of the resin +35C or higher, and in measurement of dynamic visco-elasticity at a frequency of 1 rad/sec in a nitrogen stream, complex modulus of elasticity at a temperature of the glass transition temperature of the resin +35C is less than 0.24 MPa. Further, the resin solution for heat imprint using this, the injection molded body for heat imprint, the thin film for heat imprint and its manufacturing method are provided.
TAKATANI YOSHITERU
KUSUURA TAKAHISA
MITRA ANUPAM
SCIVAX KK
| JP2005330465A | 2005-12-02 | |||
| JP2006182011A | 2006-07-13 | |||
| JP2005330465A | 2005-12-02 |
| WO2007037085A1 | 2007-04-05 | |||
| WO2007066712A1 | 2007-06-14 | |||
| WO2007018287A1 | 2007-02-15 | |||
| WO2007037085A1 | 2007-04-05 |
Gocho Ryushi