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Title:
RESIN INTERPOSER, SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2017123424
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve the reliability in connection when a resin interposer is used.SOLUTION: A resin interposer 4 includes: a first resin layer 1 which includes a plurality of through vias 1A and has a first thermal expansion coefficient; a second resin layer 2A which is formed over the first resin layer and has a second thermal expansion coefficient higher than the first thermal expansion coefficient; a wiring layer 2 including a metal wiring 2B; and a third resin layer 3 which is formed over the wiring layer including bump insertion holes 3A and has a third thermal expansion coefficient lower than the second thermal expansion coefficient.SELECTED DRAWING: Figure 1

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Inventors:
SASAKI SHINYA
KAMIYOSHI GOJI
Application Number:
JP2016002529A
Publication Date:
July 13, 2017
Filing Date:
January 08, 2016
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
H01L23/12; H01L25/065; H01L25/07; H01L25/18; H05K1/18; H05K3/46
Attorney, Agent or Firm:
Yu Sanada
Masahisa Yamamoto



 
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