Title:
RESIN LAMINATE
Document Type and Number:
Japanese Patent JP2001047573
Kind Code:
A
Abstract:
To provide a resin laminate of an SPS(syndiotactic polystyrene) suitably used particularly in a synthetic leather manufacturing field and a food packaging field and having excellent heat resistance, hot water resistance, mold releasability, heat sealability, easy tearing and mechanical physical properties and a polyolefin.
The resin laminate is obtained by sequentially laminating a layer made of a syndiotactic polystyrene resin or a resin material containing a syndiotactic polystyrene resin and having a thickness of 5 to 300 μm, a polyolefin copolymer layer made of a copolymer of an olefin monomer and a specific monomer and having a thickness of 1 to 100 μm, and a polyolefin resin layer having a thickness of 5 to 300 μm in this order.
Inventors:
Kogure, Masami
Funaki, Keisuke
Funaki, Keisuke
Application Number:
JP1999000223820
Publication Date:
February 20, 2001
Filing Date:
August 06, 1999
Export Citation:
Assignee:
IDEMITSU PETROCHEM CO LTD
International Classes:
B32B27/30; B32B27/30; (IPC1-7): B32B27/30
Previous Patent: WEATHERABLE TONED FILM AND SOLAR CELL
Next Patent: VINYL CHLORIDE RESIN END GRAIN MATERIAL
Next Patent: VINYL CHLORIDE RESIN END GRAIN MATERIAL
