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Patent Searching and Data


Title:
RESIN-MADE WAVEGUIDE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2004015472
Kind Code:
A
Abstract:

To provide a resin-made waveguide by forming a metallic layer to a combined face of resin-made waveguide main body divisions and contriving heat inside the waveguide main body to be easily escaped externally via the metallic layer so as to attain conduction of a high output electromagnetic wave and to provide a manufacturing method thereof.

In the resin-made waveguide, metallic layers 3, 4 are formed to one or both connection faces at an inner side face of resin-made waveguide components 1, 2 in a state of being divided at a cross section of the waveguide main body and forming an inner face of the waveguide main body and at the combined faces of the waveguide components, and the waveguide components 1, 2 are combined via the metallic layers 3, 4 at the combined faces 5, 6 of the waveguide components to configure the waveguide main body.


Inventors:
KANBARA RISUI
ASANO HIROYUKI
ASAO HIDEKI
Application Number:
JP2002166767A
Publication Date:
January 15, 2004
Filing Date:
June 07, 2002
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01P3/12; H01P3/123; H01P11/00; (IPC1-7): H01P3/12; H01P3/123; H01P11/00
Attorney, Agent or Firm:
Kaneo Miyata
Yahei Takase