Title:
RESIN MATERIAL, LAMINATE FILM AND MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2023156362
Kind Code:
A
Abstract:
To provide a resin material which 1) enhances embedding properties to an uneven surface, 2) suppresses excess squeeze out from a periphery of a substrate of a resin material during lamination, 3) keeps curing temperature low, 4) reduces dielectric loss tangent of a cured article, 5) enhances adhesiveness with a metal, and 6) can enhance bending stability of the cured article.SOLUTION: The resin material contains a polyimide compound, and at least one of aliphatic skeleton-containing compound of a maleimide compound having an aliphatic skeleton and a benzoxazine compound having the aliphatic skeleton.SELECTED DRAWING: Figure 1
Inventors:
KAWAHARA YUKO
HAYASHI TATSUJI
TANAKA TOSHIAKI
HAYASHI TATSUJI
TANAKA TOSHIAKI
Application Number:
JP2023122240A
Publication Date:
October 24, 2023
Filing Date:
July 27, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B32B15/08; C08L79/08; C08G59/40; C08G73/10; C08K3/013; C08K5/3445; C08L35/00; C08L63/00; H05K1/03
Attorney, Agent or Firm:
Patent Attorney Osaka Front Patent Office