Title:
RESIN MATERIAL AND MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2020132880
Kind Code:
A
Abstract:
To provide a resin material that can, in the cured product of the resin material, 1) lower the dielectric loss tangent, 2) enhance the thermal dimensional stability, 3) enhance the elongation property, and 4) enhance the bending property.SOLUTION: The resin material according to the present invention contains a polymaleimide compound that has three or more maleimide skeletons and that has one or more imide skeletons, and a curing accelerator.SELECTED DRAWING: Figure 1
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Inventors:
KAWAHARA YUKO
HAYASHI TATSUJI
KUBO AKIKO
TAKEDA KOHEI
NIIDO MASAMI
HAYASHI TATSUJI
KUBO AKIKO
TAKEDA KOHEI
NIIDO MASAMI
Application Number:
JP2020025553A
Publication Date:
August 31, 2020
Filing Date:
February 18, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08F22/40; C08G59/40; C08K3/013; C08K3/36; C08L35/00; C08L63/00; C08L101/00; H05K1/03; H05K3/46
Domestic Patent References:
| JP2012193325A | 2012-10-11 | |||
| JP2016204639A | 2016-12-08 | |||
| JP2010229313A | 2010-10-14 | |||
| JPS627710A | 1987-01-14 | |||
| JP2016079366A | 2016-05-16 |
Foreign References:
| WO2016114286A1 | 2016-07-21 |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office