Title:
RESIN MATERIAL AND MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2020132881
Kind Code:
A
Abstract:
To provide a resin material that can, in the cured product of the resin material, 1) lower the dielectric loss tangent, 2) enhance the thermal dimensional stability, 3) enhance the elongation property, 4) enhance the bending property, and 5) enhance the peel strength against metal layer.SOLUTION: The resin material according to the present invention contains a thermosetting compound, and an imide skeleton-containing maleimide compound that has one or more maleimide skeletons and two or more imide skeletons and that has at least one functional group capable of reacting with the thermosetting compound.SELECTED DRAWING: Figure 1
Inventors:
KAWAHARA YUKO
HAYASHI TATSUJI
KUBO AKIKO
TAKEDA KOHEI
NIIDO MASAMI
HAYASHI TATSUJI
KUBO AKIKO
TAKEDA KOHEI
NIIDO MASAMI
Application Number:
JP2020025554A
Publication Date:
August 31, 2020
Filing Date:
February 18, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08L101/00; C08G59/40; C08K3/013; C08K5/3412; C08L35/00; C08L63/00; H05K1/03; H05K3/46
Domestic Patent References:
| JPH01215819A | 1989-08-29 | |||
| JP2003118054A | 2003-04-23 | |||
| JP2018090728A | 2018-06-14 | |||
| JP2016131243A | 2016-07-21 | |||
| JP2012102227A | 2012-05-31 | |||
| JP2016079366A | 2016-05-16 |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office