Title:
樹脂材料供給装置、樹脂成形装置及び樹脂成形品の製造方法
Document Type and Number:
Japanese Patent JP7360365
Kind Code:
B2
Abstract:
Provided is a resin material supply device capable of controlling a supply amount of a resin material with high precision. The resin material supply device includes: a resin material supply unit for supplying a resin material; a first resin material conveying unit to which the resin material is supplied from the resin material supply unit; a second resin material conveying unit for conveying the resin material conveyed by the first resin material conveying unit to a molding die; and a control unit for adjusting, when one resin material supplied to the second resin material conveying unit is divided into a plurality of pieces and supplied from the resin material supply unit to the first resin material conveying unit by a plurality of times, a supply amount of the resin material from the resin material supply unit at a predetermined time based on a supply amount of the resin material from the resin material supply unit at a time prior to the predetermined time.
Inventors:
Takuto Teraoka
Application Number:
JP2020120415A
Publication Date:
October 12, 2023
Filing Date:
July 14, 2020
Export Citation:
Assignee:
towa corporation
International Classes:
B29C43/34; B29C31/04; B29C31/06; B29C43/18
Domestic Patent References:
| JP2015128908A | ||||
| JP2008183828A | ||||
| JP2014231185A | ||||
| JP2019181881A | ||||
| JP20171276A |
Attorney, Agent or Firm:
Toyohiko Nagata
Hidefumi Takagi
Hidefumi Takagi