Title:
RESIN MATERIAL FOR UNDERLAY FILM FORMATION, RESIST UNDERLAY FILM, METHOD FOR PRODUCING RESIST UNDERLAY FILM, AND LAMINATE
Document Type and Number:
Japanese Patent JP2022003142
Kind Code:
A
Abstract:
To provide a resin material for underlay film formation which can achieve a resist underlay film that satisfies sufficient optical characteristics and etching resistance, is excellent in flatness, and suppresses a generation amount of a volatile content.SOLUTION: A resin material for underlay film formation for forming a resist underlay film used in a multilayer resist process contains a cyclic olefin polymer (I), and has a temperature indicating an intersection between a storage elastic modulus (G') curve and a loss elastic modulus (G'') curve in solid viscoelasticity of the resin material for underlayer film formation measured using a rheometer under conditions in a nitrogen atmosphere, a shear mode, a measurement temperature range of 30-300°C, a rate of temperature rise of 3°C/min and a frequency of 1 Hz of 40°C or higher and 200°C or lower.SELECTED DRAWING: Figure 1
Inventors:
KAWASHIMA KEISUKE
ODA TAKASHI
INOUE KOJI
ODA TAKASHI
INOUE KOJI
Application Number:
JP2021164622A
Publication Date:
January 11, 2022
Filing Date:
October 06, 2021
Export Citation:
Assignee:
MITSUI CHEMICALS INC
International Classes:
C08L65/00; C08G61/06; C08L101/02; G03F7/11
Domestic Patent References:
| JP2014174428A | 2014-09-22 |
Attorney, Agent or Firm:
Shinji Hayami