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Title:
RESIN MATERIAL
Document Type and Number:
Japanese Patent JP2953252
Kind Code:
B2
Abstract:

PURPOSE: To enhance sensitivity, resolution, process aptitude, and practicability by dissolving a specified base resin, an onium salt, and a dissolution inhibitor having an acid-instable group in an organic solvent.
CONSTITUTION: This resist material comprises the base resin represented by formula I, the onium salt as an acid-generator, and further, when the dissolution inhibitor containing the acid-instable group is added, an amount of the inhibitor to be decomposed by the acid can be reduced, thus permitting change of film thickness and bubbling to be reduced, and fine precise fabrication to be favored, and the obtained resist material to be adapted to production of ultrafine LSI. In formula I, each of R1, R3, and R5 is H or methyl; R2 is t-butyl, or methoxymethyl, tetrahydropyranyl, or trialkylsilyl; R4 is lower alkoxy, such as methoxy or ethoxy; and m+n+k=1.


Inventors:
TAKEDA YOSHIFUMI
ISHIHARA TOSHINOBU
MARUYAMA KAZUMASA
ITO KENICHI
Application Number:
JP11530893A
Publication Date:
September 27, 1999
Filing Date:
April 19, 1993
Export Citation:
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Assignee:
SHINETSU KAGAKU KOGYO KK
International Classes:
G03F7/004; G03F7/029; G03F7/033; G03F7/039; H01L21/027; (IPC1-7): G03F7/039; G03F7/029; G03F7/033; H01L21/027
Domestic Patent References:
JP6167811A
JP5265214A
JP5204157A
JP643651A
JP4211258A
JP3107165A
JP2177031A
Attorney, Agent or Firm:
Takashi Kojima