樹脂モールド品 - Toshiba Corporation

Title:

樹脂モールド品

Document Type and Number:

Japanese Patent JP3621119

Kind Code:

B2

More Like This:

WO/2017/189436

Inventors:

Toshio Shimizu
Masaru Miyakawa
Kenichi Sato
Yoshihiro Kagawa
Masahiko Oishi
Satoshi Makishima
Susumu Kinoshita

Application Number:

JP3849193A

Publication Date:

February 16, 2005

Filing Date:

February 26, 1993

Export Citation:

Assignee:

Toshiba Corporation

International Classes:

H01B17/00; H01B17/58; H01B19/00; (IPC1-7): H01B17/58; H01B17/00; H01B19/00

Domestic Patent References:

JP49041916B1
JP49140700U

Attorney, Agent or Firm:

Hideaki Togawa

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