Title:
RESIN-MOLD BUSHING FOR AIRTIGHTNESS
Document Type and Number:
Japanese Patent JPH01176611
Kind Code:
A
Abstract:
PURPOSE:To make it possible to improve the airtightness and anticracking property without providing a partition wall by forming a stress relaxing layer made by reinforcing a flexible epoxy resin with a glass fiber to a center conductor. CONSTITUTION:On the periphery where a central conductor 1 and a mold resin 2 in which the central conductor 1 is penetrated and buried are contacted, a stress relaxing layer 6 made by reinforcing a flexible epoxy resin with a glass fiber is provided. That is, a stress relaxing layer 6 made by reinforcing a flexible epoxy resin with a glass fiber is formed to a center conductor 1 of a resin mold bushing for airtightness purpose. As a result, since the pulling strength of the stress relaxing layer 6 becomes to a value close to that of the mold resin 2 in a low temperature, and since the layer 6 is reinforced with a glass fiber, no crack is generated to the stress relaxing layer 6 even though a stress difference is produced between these members, no crack is generated even by severe cooling and heating cycles, and airtightness can be maintained sufficiently.
Inventors:
KAGAWA YOSHIHIRO
KOYAMA MICHIHIKO
OYAMADA MITSURU
KOYAMA MICHIHIKO
OYAMADA MITSURU
Application Number:
JP20588A
Publication Date:
July 13, 1989
Filing Date:
January 04, 1988
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01B17/26; (IPC1-7): H01B17/26
Attorney, Agent or Firm:
Kazuo Sato (2 outside)
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