Title:
RESIN MOLD AND MOLD DEVICE FOR INJECTION MOLDING
Document Type and Number:
Japanese Patent JP2675503
Kind Code:
B2
Abstract:
PURPOSE: To provide a resin mold, the cost of which is cheaper compared with a conventional mold, without damaging the characteristics of resin by installing a resin mold main body composed of curing liquid resin containing metal fine powder into the required shape on a metal base for injection molding by means of a plurality of mold fixing bolts.
CONSTITUTION: Liquid resin containing a large amount of metal fine powder such as aluminum is cast into the required shape and defoamed, and then the required mechanical processing is applied to mold the resin into a required mold. A resin mold section 2 is fixed by a plurality of mold fixing bolts 8 on a metal base 5. Four guide pins 7 are implanted around the metal base 5, and also four return pins 9 are set close to the guide pins. The upper ends of the pins 9 are brought into contact with a fixed side base face 4 of a top force 1 at the time of mold clamping of the top force 1 and a bottom force 2 in the injection molding work to prevent the generation of cracks because of the application of pressure more than required to the mold section. Thus the pressure applied to the mold section by the length of pins 9 can be controlled.
Inventors:
Maruyama Yoshikuni
Yasuhiro Sugawara
Yasuhiro Sugawara
Application Number:
JP6221493A
Publication Date:
November 12, 1997
Filing Date:
March 22, 1993
Export Citation:
Assignee:
Fiaro Corporation
International Classes:
B29C33/30; B29C33/40; B29C45/17; B29C45/26; B29C45/40; B29K105/16; (IPC1-7): B29C45/26; B29C33/30; B29C33/40
Attorney, Agent or Firm:
Tomoyuki Yathata (1 outside)