Title:
RESIN MOLD-FORMING COMPOSITION, RESIN MOLD, AND MOLDING OF RESIN MOLD
Document Type and Number:
Japanese Patent JPH04100805
Kind Code:
A
Abstract:
PURPOSE:To provide a resin mold-forming composition which can give a platy resin mold with an uneven pattern within a short time less laboriously by mixing a specified photocurable compound with a photopolymerization initiator. CONSTITUTION:A photocurable compound comprising a combination of an allyl alcohol derivative (e.g. allyl alcohol/ethylene oxide adduct) with a (poly) thiol compound (e.g. 2-mercaptoacetic acid/glecerol ester) or an acrylic ester containing an aromatic ring and/or an alicyclic ring (e.g. alkylene oxide-modified bisphenol A diacrylate is mixed with a photopolymerization initiator (e.g. benzoin) to produce a resin mold-forming composition. This composition 4 is poured into a glass vessel 3 and a base plate 2 having a light transmission part and a light shielding part is mounted on it. The composition 4 is irradiated with light 1 passed through the base plate 2, and uncured liquid part is removed to leave a resin mold.
Inventors:
SAMURA TETSUYA
Application Number:
JP5592090A
Publication Date:
April 02, 1992
Filing Date:
March 07, 1990
Export Citation:
Assignee:
SANYO CHEMICAL IND LTD
International Classes:
C08F2/44; B29C33/40; C08F2/48; B29K33/04; (IPC1-7): B29C33/40; B29K33/04; C08F2/44; C08F2/48