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Title:
RESIN MOLD, AND MANUFACTURE AND DEVICE FOR IT
Document Type and Number:
Japanese Patent JPH0992064
Kind Code:
A
Abstract:

To obtain a resin mold; wherein flexible particles are uniformly and finely dispersed in epoxy resin, and having toughness, and also heat resistance; by treating silicone gel, a flexible particle, and the epoxy resin by a disperser having specific structure.

A resin mold is manufactured by using a disperser constituted of two teeth, having a narrow gap, wherein a first outer side comb-like tooth 1 is fixed, and a second inner side comb-like tooth 2 is rotated at a high speed. The epoxy resin, after putting epoxy resin and liquid silicone gel 3 into the inner side of the second tooth 2, can be obtained by rotating the second tooth 2 at a high speed; and by compressed destruction, caused in discharging the liquid silicone gel, to an outer side than the narrow gap of the second tooth 2, and shearing current destruction, receiving in passing two teeth 2 and 1; wherein the liquid silicone gel 3 is dispersed into a fine particle 4 state, and this dispersed article is heated and molded to obtain a resin mold.


Inventors:
HIRANO YOSHIHIKO
SHIMIZU TOSHIO
JINNO YOSHIKAZU
MIYAGAWA MASARU
Application Number:
JP24165895A
Publication Date:
April 04, 1997
Filing Date:
September 20, 1995
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
B29C39/02; H01B19/00; B29K63/00; (IPC1-7): H01B19/00; B29C39/02
Attorney, Agent or Firm:
Inomata Shoaki



 
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