To provide a resin mold structure contributing to high air-tightness by reducing thermal stress caused by the difference amount of shrinkage and expansion between a mold resin and a cable when integrating an electronic part like a sensor element with the cable using the resin mold.
In the resin mold structure integrally molded with the electronic part and cable by using a molding resin, a resin mold body 10 molded with the molding resin 11 has a linear expansion coefficient in the longitudinal direction of the cable 12 different from that in the radial direction perpendicular to the longitudinal direction of the cable 12. The linear expansion coefficient in the longitudinal direction of the cable is closer to the linear expansion coefficient of the outermost layer of the cable, than the linear expansion coefficient in the radial direction of the cable.
TANBA AKIHIRO
OUCHI KEIICHI
SAITO NAOTO
HATTORI TAKASHI
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