Title:
樹脂成形品の製造装置、樹脂成形システム、および樹脂成形品の製造方法
Document Type and Number:
Japanese Patent JP6560727
Kind Code:
B2
Abstract:
The present invention relates to a production device of a resin molded product capable of reducing the variation in the thickness of the resin molded product, to a resin molding system, and to a production method of a resin molded product. The production device of the resin molded product comprises: a first platen; a first type holder provided on the first platen; and a second platen disposed to face the first platen, wherein the first type holder includes a first heat insulating member on a first platen side and a first type holder heater on a second platen side, and the first platen has a first platen heater configured to heat the first platen.
Inventors:
Hideo Ichihashi
Yusuke Shimoda
Yusuke Shimoda
Application Number:
JP2017206003A
Publication Date:
August 14, 2019
Filing Date:
October 25, 2017
Export Citation:
Assignee:
towa corporation
International Classes:
B29C33/02; B29C39/10; B29C39/26
Domestic Patent References:
| JP6031736A | ||||
| JP9029747A |
Attorney, Agent or Firm:
Fukami patent office