Title:
RESIN MOLDED PRODUCT AND HIGH-FREQUENCY EQUIPMENT
Document Type and Number:
Japanese Patent JP2023044232
Kind Code:
A
Abstract:
To provide a resin-molded product for high-frequency equipment capable of improving design flexibility while reducing manufacturing costs, and high-frequency equipment.SOLUTION: The resin molded product for accommodating circuits that transmit and receive electromagnetic waves includes: a flat part including a scale-like first graphite filler; and a transmission part that is formed integrally with the flat part including a scale-like second graphite filler. The flat part has a flat plate shape that has a first plane and a second plane. The transmission part has an uneven shape formed with multiple first concavities that recess in a first direction and the cross-sectional area that decreases continuously in the first direction and multiple second concavities that recess in a second direction and the cross-sectional area that decreases continuously in the second direction. The first concavity has a side wall inclined at an angle greater than or equal to 65 degrees and less than 90 degrees with respect to the first plane, and the second concavity has a side wall inclined at an angle of 65 degrees or more and less than 90 degrees with respect to the second plane. The first graphite filler is placed along the shape of the flat part, and the second graphite filler is placed along multiple first concavity sidewalls or multiple second concavity sidewalls.SELECTED DRAWING: Figure 1
Inventors:
TSURUTA TAKASHI
KUWABARA RYO
NISHIKI NAOMI
KUWABARA RYO
NISHIKI NAOMI
Application Number:
JP2021152150A
Publication Date:
March 30, 2023
Filing Date:
September 17, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H01Q1/42; G01S7/03; H01Q17/00; H05K9/00
Attorney, Agent or Firm:
Michiko Matsutani
Hiroshi Okabe
Kenichi Nakatani
Hiroshi Okabe
Kenichi Nakatani