Title:
樹脂成形装置、及び樹脂成形品の製造方法
Document Type and Number:
Japanese Patent JP7134926
Kind Code:
B2
Abstract:
Provided are a resin molding apparatus and a method of manufacturing a resin molded article, which can suppress curing of a liquid resin having thermosetting properties earlier than an appropriate time. The resin molding apparatus comprises: a molding die; a die clamping mechanism; a film supply mechanism; a liquid resin supply mechanism; and a control part. The molding die comprises an upper die and a lower die opposite to the upper die. The die clamping mechanism clamps the molding die. The film supply mechanism supplies a release film between the upper die and the lower die. The liquid resin supply mechanism supplies a thermosetting liquid resin to the release film. The control part controls the liquid resin supply mechanism so as to supply the liquid resin onto the release film in a state where the release film is separated from the lower die.
Inventors:
Satoshi Nakao
Toshinori Kasai
Takuto Teraoka
Kimura Hikaru
Toshinori Kasai
Takuto Teraoka
Kimura Hikaru
Application Number:
JP2019128101A
Publication Date:
September 12, 2022
Filing Date:
July 10, 2019
Export Citation:
Assignee:
towa corporation
International Classes:
B29C43/36; B29C33/68; B29C43/18; B29C43/50
Domestic Patent References:
| JP2016015522A | ||||
| JP2009083438A | ||||
| JP2017183443A | ||||
| JP2018051841A | ||||
| JP2010034447A | ||||
| JP2007301950A | ||||
| JP2005219297A |
Attorney, Agent or Firm:
Kenji Tachibana
Go Masuda
Go Masuda