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Title:
RESIN MOLDING APPARATUS, METHOD FOR MOLDING RESIN USING THE APPARATUS, AND RESIN MOLDING
Document Type and Number:
Japanese Patent JP2003094490
Kind Code:
A
Abstract:

To homogeneously transfer a wide transfer surface when a molding which can not be homogenized sufficiently due to various flow distributions and temperature distributions is to be molded.

A cavity 2 is formed by a lower side mold 1 and an upper side mold, and a plurality of gates 3 are formed in the mold 1. In the mold 1, an outside air introduction part penetrating the outside of the mold 1 and the inside of the cavity 2 is formed as an outside air introduction part 4a corresponding to a gate radial direction part A and an outside air introduction part 4b corresponding to radial direction part B between the gates such as the periphery of a weld part, and the opening area of the introduction part 4b is formed to be larger than the opening area of the introduction part 4a. Each of the introduction parts 4a and 4b has independent ventilation channel, and the ventilation channel can be opened/closed by being controlled independently by a controller.


Inventors:
Senoo, Shinya
Hatakeyama, Toshiharu
Application Number:
JP2001000288124
Publication Date:
April 03, 2003
Filing Date:
September 21, 2001
Export Citation:
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Assignee:
RICOH CO LTD
International Classes:
B29C45/26; B29C45/73; B29C45/26; B29C45/73; (IPC1-7): B29C45/26; B29C45/73