樹脂モールド装置及び樹脂モールド方法

Title:

樹脂モールド装置及び樹脂モールド方法

Document Type and Number:

Japanese Patent JP7312452

Kind Code:

B2

Abstract:

To provide a resin molding device that improves the molding quality by supplying an appropriate amount of resin for each workpiece without generating dust and does not generate unnecessary resin in a molded product.SOLUTION: A resin molding device includes a sheet resin supply unit 14 that supplies a single-wafer sheet-like resin R, a sheet-shaped resin removing unit 18 removes a part of the sheet-shaped resin R supplied from the sheet-shaped resin supply unit 14, which is surplus with respect to the work W in which the mounting rate of an electronic component Wt exceeds a reference value, and a resin loader 4 that conveys an appropriate amount of sheet-shaped resin R removed by the sheet-shaped resin removing unit 18 to a mold 2.SELECTED DRAWING: Figure 1

Inventors:

Takashi Saito
Hideo Nakayama

Application Number:

JP2020009783A

Publication Date:

July 21, 2023

Filing Date:

January 24, 2020

Export Citation:

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