Title:
RESIN MOLDING APPARATUS USING RELEASE FILM
Document Type and Number:
Japanese Patent JP3241553
Kind Code:
B2
Abstract:
PURPOSE: To perform efficient resin molding by assembling other members, whose heat conductivity is different from that of the raw material of the base parts of molding dies, into a site wherein the molding dies constitute a resin molding part, and making it possible to use the material having high heat conductivity as the raw material of the molding die.
CONSTITUTION: As a resin molding apparatus using a release film 4, the constitution of a transfer molding device for sealing semiconductor resin and a resin molding device are used, and a lead frame 20 is resin-molded. At this time, a cavity recess part for resin molding is provided for an upper die 10a and a lower die 10b. As the base members of the upper die 10a and the lower die 10b, steel is used. For cavity-bottom pieces 22a and 22b constituting the bottom part of the cavity recess part, which is to become the resin molding part, raw material having the excellent heat conductivity such as copper, aluminum or alloy thereof other than the stell is used. Furthermore, the clamping surfaces of the upper die 10a and the lower die 10b in contact with the article to be molded and the inner surface of the cavity recess part are formed of steel.
Inventors:
Fumio Miyajima
Application Number:
JP28693494A
Publication Date:
December 25, 2001
Filing Date:
November 21, 1994
Export Citation:
Assignee:
Apic Yamada Co., Ltd.
International Classes:
B29C45/73; B29C33/38; B29C33/68; B29C45/02; B29C45/14; B29C45/78; H01L21/56; (IPC1-7): B29C45/14; B29C33/38; B29C33/68; B29C45/02; B29C45/73; H01L21/56
Domestic Patent References:
| JP61167515A | ||||
| JP7283260A |
Other References:
【文献】米国特許3754070(US,A)
【文献】Hans Gastrow原著,森隆訳,「射出成形金型」,株式会社工業調査会,1986年10月15日,p269,270
【文献】Hans Gastrow原著,森隆訳,「射出成形金型」,株式会社工業調査会,1986年10月15日,p269,270
Attorney, Agent or Firm:
Takao Watanuki (1 outside)