To provide a resin molding apparatus capable of well preventing dents, impressions, inclusion of foreign substances, poor appearance or the like from being generated on the back surface of a film substrate.

The resin molding apparatus 10 is equipped with a conveying means 17 for conveying a tape-like thin film on which a plurality of the film substrates 21 carrying a semi-conductor chip 22 on the surface and exposing a plurality of input/output terminals on the back surface are continuously formed in the longitudinal direction, and a resin sealing means pinching the thin film by a first mold 14 for pressing the film substrate 21 from the surface side and by a second mold 15 for pressing the film substrate 21 from the back surface side, and pouring a sealing material in a sealing space 16 to seal the surface side of the film substrate 21 with a resin. A protective film feeding means 19 for feeding a tape-like protective film 40 for protecting the input/output terminals in accordance with conveying the thin film is provided. The resin sealing means performs resin sealing under a condition that the protective film 40 is arranged on the back surface side of the film substrate 21 and is pinched.