Title:
樹脂成形装置、及び樹脂成形品の製造方法
Document Type and Number:
Japanese Patent JP6894403
Kind Code:
B2
Abstract:
The present invention is a resin molding device to suppress deterioration of the quality of a resin material, and includes: a resin molding module (3A) and a resin molding module (3B) for molding resin; a conveyance mechanism (5) for delivering a resin material to the resin molding modules (3A) and (3B); a resin supply module (8) for housing and supplying the resin material to the conveyance mechanism (5); a suction mechanism (10) (dust-collecting mechanism) for sucking dust in the resin supply module (8); and a control unit (9) for controlling the dust-collecting mechanism (10), wherein the control unit (9) intermittently performs suction with use of the dust-collecting mechanism (10).
Inventors:
Shinya Nakajima
Fuyuhiko Ogawa
Masaaki Ren
Takahashi Takashi
Akira Kitahara
Fuyuhiko Ogawa
Masaaki Ren
Takahashi Takashi
Akira Kitahara
Application Number:
JP2018099707A
Publication Date:
June 30, 2021
Filing Date:
May 24, 2018
Export Citation:
Assignee:
towa corporation
International Classes:
B29C45/02; B29B13/06; B29C31/00; B29C43/18; B29C43/34
Domestic Patent References:
| JP5267367A | ||||
| JP2018027670A |
Attorney, Agent or Firm:
Ryuhei Nishimura
Saito Shindai
Uemura Yoshinaga
Saito Shindai
Uemura Yoshinaga