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Title:
樹脂成形装置および樹脂成形方法
Document Type and Number:
Japanese Patent JP6798269
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin molding apparatus and a resin molding method capable of employing all thermoplastic resins by use of a resin mold formed by three-dimensional modeling, and by injecting a resin material for product into the resin mold.SOLUTION: The resin molding apparatus has: a stage; a storage vessel installed on the stage; an energy ray irradiation part emitting an energy ray; an injection part plasticizing a first material being a synthetic resin and injecting the same from an injection port; and driving means that enables the stage, the energy ray irradiation part and the injection part to move relatively three-dimensionally. The storage vessel has a table inside drivable in at least the gravity direction and is stored with a liquid second material including an energy ray curable resin cured by the energy ray.SELECTED DRAWING: Figure 1

Inventors:
Kenta Anekawa
Kanai Yasuto
Yokota Kei
Application Number:
JP2016224799A
Publication Date:
December 09, 2020
Filing Date:
November 18, 2016
Export Citation:
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Assignee:
Seiko Epson Corporation
International Classes:
B29C64/129; B29C64/40; B33Y10/00; B33Y30/00
Domestic Patent References:
JP200286574A
JP994883A
JP2009274338A
Attorney, Agent or Firm:
Kazuaki Watanabe
Satoshi Nakai
Hiroki Matsuoka