Title:
樹脂成形装置および樹脂成形方法
Document Type and Number:
Japanese Patent JP6812811
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin mold for 3D molding, a resin molding apparatus making it possible to use any thermoplastic resin by injecting a product resin material into the resin mold and further to integrally mold a member of a material different from the product resin material, and a resin molding method.SOLUTION: The resin molding apparatus includes: a stage; a storage tank installed on the stage; an energy beam applying unit for applying an energy beam; an injection unit for plasticizing a first material which is a synthetic resin and injecting the plasticized material from an injection port; driving means for enabling relative three-dimensional movement of the stage, the energy beam applying unit, and the injection unit; and an insertion member supply unit that supplies an insertion member formed of a material different from the first material to the second molded product. The storage tank has therein at least a table that can be driven in the direction of gravity and stores a liquid second material containing an energy beam-curable resin which is cured by the energy beam.SELECTED DRAWING: Figure 1
Inventors:
Kenta Anekawa
Yukio Miyamoto
Kanai Yasuto
Yokota Kei
Yukio Miyamoto
Kanai Yasuto
Yokota Kei
Application Number:
JP2017010969A
Publication Date:
January 13, 2021
Filing Date:
January 25, 2017
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
B29C64/106; B29C64/124; B29C64/40; B33Y10/00; B33Y30/00
Domestic Patent References:
| JP2002086574A | ||||
| JP9094883A | ||||
| JP2009274338A |
Attorney, Agent or Firm:
Kazuaki Watanabe
Satoshi Nakai
Hiroki Matsuoka
Satoshi Nakai
Hiroki Matsuoka