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Patent Searching and Data


Title:
RESIN MOLDING FOR LASER MARKING
Document Type and Number:
Japanese Patent JPH10193402
Kind Code:
A
Abstract:

To clarify the contrast between the irradiation part and the non- irradiation part of laser, and improve the visibility of marked parts by providing a coated layer specified in its wall thickness and surface luster with resin having a specified heat conductivity and melting point on the surface with which the laser marking parts of a molding are brought into contact.

The injection mold is used which is formed with a coated layer satisfying simultaneously conditions denoted by (a) and (b) in a mold inner surface, i.e., in a cavity inner surface defined between both molds created by mating the protrusion mold with recess mold. Herein, formation is done with a resin layer consisting of resin having a heat conductivity of 1×10-4-30×10-4cal/cm.sec°C, and a melting point or softening point of 15°C or higher, or having no melting point or softening point (a). For such resin showing these physical values, polyethyleneterephthalate, polytertrafluoroethylene, or the like can be give. The coating layer (b) is made 60% or more in its surface luster, and the resin layer is made 5-1000μm in its wall thickness.


Inventors:
MATSUOKA KENJI
TSUTSUMI IKUO
Application Number:
JP629597A
Publication Date:
July 28, 1998
Filing Date:
January 17, 1997
Export Citation:
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Assignee:
NIPPON PORIKEMU KK
International Classes:
B29C33/38; B29C45/26; B29C45/37; (IPC1-7): B29C45/26; B29C33/38; B29C45/37
Attorney, Agent or Firm:
Tsutomu Toyama (2 outside)