Title:
RESIN MOLDING AND MANUFACTURING METHOD OF RESIN MOLDING
Document Type and Number:
Japanese Patent JP2020193298
Kind Code:
A
Abstract:
To provide a resin molding with high heat-resistance while maintaining flexibility, in a single film of a resin molding of at least several dozen μm thick, composed of a photocurable composition, and also to provide a manufacturing method thereof.SOLUTION: A resin molding includes a photocurable composition. The photocurable composition includes: a photo-curing initiator; and at least two types of urethane (meth)acrylate having a urethane skeleton and at least two (meth)acryloyl groups. A content of the photo-curing initiator in the photocurable composition is 0.1 to 8 wt.% based on a total amount of the urethane (meth)acrylate. The photo-curing initiator is an intramolecular cleavage type initiator with a molecular weight of 300 or more. The resin molding has 5% weight loss temperature of 280°C or higher, and 7% weight loss temperature of 285°C or higher, in a thermogravimetric measurement (TGA).SELECTED DRAWING: Figure 1
Inventors:
NISHIKAWA YOHEI
Application Number:
JP2019101154A
Publication Date:
December 03, 2020
Filing Date:
May 30, 2019
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
C08F299/06; B29C41/28