Title:
RESIN MOLDING METHOD FOR CONNECTION BOARD FOR MOLDED MOTOR AND RESIN MOLDING FORMING MOLD APPARATUS
Document Type and Number:
Japanese Patent JPH09308190
Kind Code:
A
Abstract:
To keep the precision of the circuit pattern of a connection board high and to prevent the defects of the connection board as well.
A metal circuit board 1 having a circuit pattern formed by punching a conductive metal board with a press is arranged on pressing pins 3 in the cavities of a forming die apparatus consisting of an upper mold 4a and the lower mold 4b for resin molding, and the metal circuit board 1 is interposed between the pressing pins 3 provided in the forming mold apparatus, and is pressed from above and below and is fixed. Next, a connection board in a predetermined shape is manufactured by filling molding spaces with a synthetic resin 2 from a filling apparatus through filling ports provided in the molds 4a, 4b.
More Like This:
| JP2003164083 | PERMANENT MAGNET AND MOTOR |
| JP2019092340 | ARMATURE |
| JP2008067456 | CORE, DIVIDED STATOR, AND STATOR |
Inventors:
MIYASHITA TOMOHITO
MORIZAKI MASAHIKO
KAWAMOTO MATSUO
KONDO MOTOTERU
MORIZAKI MASAHIKO
KAWAMOTO MATSUO
KONDO MOTOTERU
Application Number:
JP11986196A
Publication Date:
November 28, 1997
Filing Date:
May 15, 1996
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H02K1/04; H02K3/46; H02K5/22; H02K11/00; H05K3/00; H05K3/20; (IPC1-7): H02K11/00; H02K1/04; H02K3/46; H02K5/22
Attorney, Agent or Firm:
滝本 智之 （外１名）