Title:
RESIN MOLDING METHOD AND RESIN MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2022126095
Kind Code:
A
Abstract:
To suppress the difference in the amount of shrinkage between a thin-walled portion and a thick-walled portion of a resin molded article.SOLUTION: In a first solidification step, a pressure of 50% of a holding pressure in a second solidification step is applied until a first cooling time 304 when a temperature distribution 301 of a thin-walled portion 103 becomes equal to or lower than a glass transition temperature Tg. In the second solidification step, after the thin-walled portion 103 solidifies, 100% of the holding pressure is applied until a second cooling time 305 when a temperature distribution 302 of a gate 106 becomes equal to or lower than the glass transition temperature Tg.SELECTED DRAWING: Figure 9
Inventors:
SAKAMOTO YOSHINORI
KASANO SHINKO
KASANO SHINKO
Application Number:
JP2021023961A
Publication Date:
August 30, 2022
Filing Date:
February 18, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
B29C45/77; B29C33/42; B29C45/37; B29C45/73
Attorney, Agent or Firm:
Patent Attorney Corporation Maeda Patent Office
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