Title:
RESIN MOLDING MOLD
Document Type and Number:
Japanese Patent JP3529597
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin molding mold which improves a product yield when an insulating ring-shaped part is formed in a wafer and can extends the service lives of lower and upper molds made from a resin.
SOLUTION: An upper mold 12 and a lower mold 11, which are formed from a resin and have cylindrical end parts, and metallic upper and lower molds which hold the cylindrical end parts 15A, 16A of the resinous upper and lower molds to be able to butt each other and form a cavity which enclose the peripheral parts of abutting surfaces are provided. A wafer is mounted on the abutting surface of the resinous lower mold, the peripheral part of the wafer is protruded into the cavity to be held by the resinous upper and lower molds, a heat-resistant, insulating resin is packed into the cavity to cover the the peripheral part of the wafer. The abutting surfaces of the resinous upper and lower molds 12, 11 are formed in the shape of a dish, and ring-shaped grooves 18A, 18B are formed inside the peripheral parts of the abutting surfaces.
Inventors:
Shiyaura, Hajime
Sato, Mitsuo
Sato, Keinosuke
Sato, Mitsuo
Sato, Keinosuke
Application Number:
JP21641597A
Publication Date:
May 24, 2004
Filing Date:
August 11, 1997
Export Citation:
Assignee:
TOSHIBA MICROELECTRON CORP
TOSHIBA CORP
TOSHIBA CORP
International Classes:
B29C33/12; B29C33/42; H01L21/56; (IPC1-7): B29C33/42; B29C33/12; H01L21/56
Attorney, Agent or Firm:
佐藤 一雄 （外３名）
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