Title:
RESIN MOLDING
Document Type and Number:
Japanese Patent JP2016211310
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin molding suppressed in transmission of heat to a substance which has been brought into contact with the resin molding.SOLUTION: In a resin molding in which protrusions 11 and recesses 12 are alternately formed on at least one surface, a width W1 of the protrusion 11 is 1 to 2.5 mm, a width W2 of the recess 12 is 1 to 3.5 mm, a distance H between an apex 11a of the protrusion 11 and a bottom 12a of the recess 12 which is adjacent to the protrusion 11 is 1 to 3 mm, a curved face part 11c whose curvature radius is 0.1 to 0.5 mm is provided between the apex 11a of the protrusion 11 and a side face part 11b, a surface length which is obtained by summing up a length of the apex 11a in a width direction, and lengths in the width direction of the two curved face parts 11c present at both ends of the apex 11a is 1 to 2.8 mm, and a percentage of the surface length to a width of the resin molding is 40 to 80%.SELECTED DRAWING: Figure 3
Inventors:
MIZUNO YOSHITAKA
Application Number:
JP2015097959A
Publication Date:
December 15, 2016
Filing Date:
May 13, 2015
Export Citation:
Assignee:
FUKUVI CHEM IND CO
International Classes:
E04F15/10; C08J9/06
Domestic Patent References:
| JP2010196257A | 2010-09-09 | |||
| JP2006132109A | 2006-05-25 | |||
| JP2001310772A | 2001-11-06 | |||
| JP2014129511A | 2014-07-10 | |||
| JP2008297740A | 2008-12-11 | |||
| JP2005127024A | 2005-05-19 |
Attorney, Agent or Firm:
Etsushi Kotani
Masataka Otani
Masashi Haruji
Masataka Otani
Masashi Haruji