Title:
光半導体装置用樹脂成形体及び光半導体装置
Document Type and Number:
Japanese Patent JP7399678
Kind Code:
B2
Abstract:
The purpose of the present disclosure is to provide: a resin molded body for an optical semiconductor device which emits light that is more uniform and brighter due to a decrease in light loss; and an optical semiconductor device comprising said resin molded body for an optical semiconductor device. A resin molded body 1 for an optical semiconductor device according to the present disclosure has a front surface 10 and a rear surface 11 which face mutually opposite sides in the thickness direction thereof, and has, in the front surface 10, a recess section 13 recessed from an opening section12 toward the rear surface 11. The recess section 13 has: n (n is an integer no less than 5) reflective surfaces 14 and bottom surfaces 15 on the inner wall thereof. The shape of the opening section 12 of the recess section 13 is an approximate n--polygon that satisfies conditions (1) and (2) below where n is the same as n mentioned above. (1) All the internal angles of the approximate n-polygon are dull angles. (2) All the sides of the approximate n-polygon are not parallel to each other. A shape 16 formed by an arbitrary surface parallel to the opening section 12 and the inner wall of the recess section 13 is an approximate n-polygon that is approximately similar to the opening section 12 of the recess section 13.
Inventors:
Hiroyuki Hirakawa
Yasuo Yamamoto
Yasuo Yamamoto
Application Number:
JP2019195431A
Publication Date:
December 18, 2023
Filing Date:
October 28, 2019
Export Citation:
Assignee:
Daicel Corporation
International Classes:
H01L33/60; H01L23/29; H01L23/31
Domestic Patent References:
| JP2016201408A | ||||
| JP201244206A | ||||
| JP2012530342A | ||||
| JP200954593A | ||||
| JP2016106431A | ||||
| JP2019530970A | ||||
| JP2015537348A | ||||
| JP3214714U |
Attorney, Agent or Firm:
Patent Attorney Corporation G-chemical