Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
Resin multilayer substrate
Document Type and Number:
Japanese Patent JP6089614
Kind Code:
B2
More Like This:
JP2008140941MOUNTING STRUCTURE
JP4756710Bending rigid printed wiring board and its manufacturing method
JPH09293970METHOD OF MANUFACTURING LAMINATED CIRCUIT SUBSTRATE
Inventors:
Yoshito Otsubo
Application Number:
JP2012252101A
Publication Date:
March 08, 2017
Filing Date:
November 16, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K3/46; H05K1/02
Domestic Patent References:
JP2004140018A
JP8139455A
JP2012015239A
JP2004311563A
Foreign References:
WO2012140964A1
Attorney, Agent or Firm:
Fukami patent office



 
Previous Patent: A communication machine and a correspondence procedure

Next Patent: CONTROL METHOD FOR AMOUNT OF REFUSE TO BE INCINERATED IN INCINERATOR