RESIN PACKAGE AND ELECTRONIC APPARATUS USING THE RESIN PACKAGE

Title:

RESIN PACKAGE AND ELECTRONIC APPARATUS USING THE RESIN PACKAGE

Document Type and Number:

Japanese Patent JP2015005687

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To enhance the reliability of a resin package having an external terminal exposed from a resin frame.SOLUTION: The resin package includes: a metal plate 11; a resin frame 12 combined with the metal plate 11; and an external terminal 11A which is provided to a side part of the frame 12 and is electrically connected to the metal plate 11. A first resin part 15A covers a first side face of the external terminal 11A, and a second resin part 15B covers a second side face of the external terminal 11A.

Inventors:

KOGA SHUJI
NISHI TAKAHIRO
ARAKI TAKESHI
MASAOKA KATSUHIKO
YUGE RYOTA

Application Number:

JP2013131368A

Publication Date:

January 08, 2015

Filing Date:

June 24, 2013

Export Citation:

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Assignee:

PANASONIC CORP

International Classes:

H01L23/48

Domestic Patent References:

JP2011222602A	2011-11-04
JP2011181819A	2011-09-15
JP2012231115A	2012-11-22

Attorney, Agent or Firm:

Yoshiaki Tokuda
Nomura Koichi

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