Title:
樹脂パッケージ及び発光装置
Document Type and Number:
Japanese Patent JP6974741
Kind Code:
B2
Abstract:
A resin package defining a recess includes a first lead having an element-mounting region, a second lead having a wire-connecting region, and a resin body including first to third resin portions. The third resin portion surrounds the element-mounting region. Each of the first and second leads includes a first plating and a second plating covering at least a portion of the first plating. The wire-connecting region is located outward of the third resin portion. The element-mounting region is located on an outermost surface of the second plating. In a top view, the wire-connecting region is located laterally inward of a portion of the second plating of the second lead that has an outermost surface located higher than that of the first plating of the second lead.
Inventors:
Kazuya Matsuda
Kato Yasuo
Hiroyuki Tanaka
Kato Yasuo
Hiroyuki Tanaka
Application Number:
JP2018242142A
Publication Date:
December 01, 2021
Filing Date:
December 26, 2018
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/62; H01L23/28; H01L23/48
Domestic Patent References:
| JP2012129458A | ||||
| JP201541683A | ||||
| JP2007149823A | ||||
| JP2015008237A | ||||
| JP2010199547A | ||||
| JP201769539A |
Foreign References:
| WO2012049853A1 | ||||
| US20070243645 | ||||
| KR1020170082887A | ||||
| KR1020140143701A |
Attorney, Agent or Firm:
Seiji Okuda
Osamu Kita
Michi Kajitani
Akiko Miyake
Yu Tanaka
Murase Nariyasu
Hiroyuki Takeda
Osamu Kita
Michi Kajitani
Akiko Miyake
Yu Tanaka
Murase Nariyasu
Hiroyuki Takeda
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