Title:
RESIN PARTICLE
Document Type and Number:
Japanese Patent JP2010047752
Kind Code:
A
Abstract:
To provide a resin particle excellent in melting at a low-temperature and in a short time and heating adhesiveness, with a uniform particle diameter.
A resin particle (C) is formed by adhering a shell layer (S) containing a crystalline polyurethane resin (U) on a surface of a core layer (Q) containing a resin (R). The resin particle in which maximum peak temperature (Ta) of heat of fusion of (U) is 40-100C and a ratio of a softening point and the maximum peak temperature (Ta) of the heat of fusion (softening point/Ta) is 0.8-1.55, is used.
Inventors:
IWAWAKI EIJI
Application Number:
JP2009171795A
Publication Date:
March 04, 2010
Filing Date:
July 23, 2009
Export Citation:
Assignee:
SANYO CHEMICAL IND LTD
International Classes:
C08J3/12; C08G18/00
Domestic Patent References:
JP2007057660A | 2007-03-08 |