Title:
樹脂粒子、導電性粒子、導電材料及び接続構造体
Document Type and Number:
Japanese Patent JP7411553
Kind Code:
B2
Abstract:
Provided is a resin particle that can be uniformly brought into contact with an adherend, can effectively enhance adhesion to a conductive portion and impact resistance when electrodes are electrically connected to each other using a conductive particle having the conductive portion formed on a surface thereof, and further can effectively reduce connection resistance. In the resin particle according to the present invention, an exothermic peak is observed when differential scanning calorimetry is performed by heating the resin particle at a temperature rising rate of 5° C./min from 100° C. to 350° C. in an air atmosphere.
Inventors:
Hiroyuki Morita
Takeshi Wakiya
Takeshi Wakiya
Application Number:
JP2020538868A
Publication Date:
January 11, 2024
Filing Date:
March 18, 2020
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C08L101/12; C08F12/08; C08G59/50; C08J3/12; C08K3/08; H01B1/00; H01B1/22; H01B5/00; H01R11/01
Domestic Patent References:
| JP2016183300A | ||||
| JP3047877A | ||||
| JP2011063761A | ||||
| JP2012124035A | ||||
| JP2018142552A |
Foreign References:
| WO2018016138A1 | ||||
| WO2006080247A1 | ||||
| WO2014189028A1 |
Attorney, Agent or Firm:
Patent Attorney Osaka Front Patent Office