To provide a resin plate cutting-off apparatus and a resin plate cutting-off method substantially eliminating generation of a chip and capable of easily cutting-off.
The resin plate cutting apparatus is provided with a rotation base 3 provided with a heater approximately disc-like disposed and rotatable making a center 2 of the heater 1 as a rotation center; a cutting blade 4 retreatably provided in approximately opposed to the heater 1; and a resin plate 5 placed on the rotation base 3 so as to be positioned between the heater 1 and the cutting blade 4. In the apparatus, the resin plate 5 is cut by biting the cutting blade 4 to the resin plate 5 by approaching of the cutting blade 4 to the direction of the heater 1. In the resin plate cutting method, the resin plate 5 is cut by rotating the resin plate 5 approaching/opposed to the heater 1 approximately disc-like disposed and biting the cutting blade 4 to the resin plate 5 from an opposite side to the heater 1.
KADOGUCHI SEIJI
YAMAGUCHI TATSUYA
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