Title:
RESIN SEAL EQUIPMENT
Document Type and Number:
Japanese Patent JPH06124970
Kind Code:
A
Abstract:
PURPOSE: To obtain a resin seal equipment which can realize, with high reproducibility, a resin seal semiconductor element having a specified shape, without depending the amount of injection resin.
CONSTITUTION: A semiconductor element, a lead frame, and resin 14 are set between a sealing top force 12 and a sealing lower force 13. Resin sealing is executed by applying pressure to the resin via plungers 1 inserted into a cavity part of the sealing lower force. At this time, a plurality of the plungers are dipped in an oil pressure tank 2, and uniform pressure is applied to each plunger when a pressure is applied from the outside. As the result, a resin seal semiconductor element having a stable shape can be obtained.
More Like This:
Inventors:
NISHINO NORIO
Application Number:
JP27258092A
Publication Date:
May 06, 1994
Filing Date:
October 12, 1992
Export Citation:
Assignee:
MATSUSHITA ELECTRONICS CORP
International Classes:
B29C45/02; B29C45/26; H01L21/56; B29L31/34; (IPC1-7): H01L21/56; B29C45/02; B29C45/26
Attorney, Agent or Firm:
Akira Kobiji (2 outside)