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Patent Searching and Data


Title:
RESIN SEALED HYBRID INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JPS62232945
Kind Code:
A
Abstract:

PURPOSE: To prevent the generation of exfoliation and cracks of the substrate of an electron part, and to prevent the disconnection of a wiring, a bonding wire and the like by a method wherein the rubber layer covering the electron parts is provided in such a manner that it does not come in contact with the sealed resin layer provided covering the electron parts.

CONSTITUTION: A sealed resin layer 9 is provided covering the electron parts 3, 4, 5 and 6 provided on a substrate 2. At that time, a rubber layer 7 is provided in such a manner that it covers the part 3, 4, 5 and 6 without coming into contact with the resin layer 9. Said rubber layer 7 consists of silicon rubber. As a result, the exfoliation of the parts 3, 4, 5 and 6 from the substrate 2, disconnection of a wiring, a bonding wire and the like can be prevented.


Inventors:
SAWADA YUKO
TAKAHAMA TAKASHI
Application Number:
JP7885486A
Publication Date:
October 13, 1987
Filing Date:
April 02, 1986
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/28; H01L23/29; H01L23/31; H05K3/28; (IPC1-7): H01L23/28
Attorney, Agent or Firm:
Masuo Oiwa