Title:
RESIN-SEALED SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP2785770
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve moisture resistance by putting resin in an opening part of sealing resin generated by an exhaust tube for fixing a die pad during resin sealing.
SOLUTION: An exhaust hole 6 is shaped in a bottom force 1 and a plunger 8 is put in a hole part connected with the exhaust hole 6. An exhaust tube 7 which is movable up and down is fixed to a hole part below a semiconductor element 3 of the exhaust hole 6. A lead frame 4 whereon the semiconductor element 3 is mounted is mounted on the bottom force 1 and a top force 2 is put thereon. The exhaust tube 7 is brought into contact with a die pad and a die pad is fixed by carrying out exhaust by the exhaust hole 6. Resin is injected and a cavity 5 is charged with main sealing resin 10a. A resin tablet 9 is supplied onto the plunger 8 and resin is injected by the plunger 8 after the exhaust tube 7 is backed into the bottom force 1.
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Inventors:
MATSUOKA NAONORI
Application Number:
JP29494795A
Publication Date:
August 13, 1998
Filing Date:
October 19, 1995
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
B29C45/34; B29C45/02; B29C45/14; H01L21/56; H01L23/28; H01L23/50; (IPC1-7): H01L21/56; B29C45/02; B29C45/14; B29C45/34
Domestic Patent References:
| JP4106963A | ||||
| JP582573A | ||||
| JP5102217A | ||||
| JP555280A |
Attorney, Agent or Firm:
Yusuke Omi